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| TDA2822 DUAL POWER AMPLIFIER .SUPPLYVOLTAGEDOWNTO3V .LOWCROSSOVERDI .LOWQUI .BRI STORSION ESCENT CURRENT DGE OR STEREO CONFIGURATION POW ERDIP (Plastic 12+2+2) ORDERING NUMBER : TDA2822 DESCRIPTION The TDA2822 is a monolithic integrated circuit in 12+2+2 powerdip, intended for use as dual audio power amplifier in portable radios and TS sets. TYPICAL APPLICATION CIRCUIT (STEREO) March 1995 1/11 TDA2822 PIN CONNECTION (top view) SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Vs Io Ptot Tstg, Tj Supply Voltage Output Peak Current Total Power Dissipation at Tamb = 50 C at Tcase = 70 C Storage and Junction Temperature Parameter Value 15 1.5 1.25 4 - 40 to 150 Unit V A W W C 2/11 TDA2822 THERMAL DATA Symbol Rth j-amb R th j-case Parameter Thermal Resistance Junction-ambient Thermal Resistance Junction-pins Max Max Value 80 20 Unit C/W C/W ELECTRICAL CHARACTERISTICS (Vs = 6 V, Tamb = 25 C, unless otherwise specified) STEREO (test circuit of fig. 1) Symbol Vs Vc Id Ib Po Parameter Supply Voltage Quiescent Output Voltage Quiescent Drain Current Input Bias Current Output Power (each channel) d = 10 % Vs = 9 V Vs = 6 V Vs = 4.5 V f = 1 kHz f = 1 kHz Rs = 10 k B = 22 Hz to 22 kHz Curve A f = 100 Hz Rg = 10 k f = 1 kHz 24 f = 1 kHz RL = 4 RL = 4 RL = 4 1.3 0.45 36 100 2.5 2 30 50 Vs = 9 V Vs = 6 V Test Condition Min. 3 4 2.7 6 100 1.7 0.65 0.32 39 41 12 Typ. Max. 15 Unit V V V mA nA W W W dB k V V dB dB Gv Ri e Closed Loop Voltage Gain Input Resistance Total Input Noise N SVR CS Supply Voltage Rejection Channel Separation BRIDGE (test circuit of fig. 2) Vs Id Vos Ib Po Supply Voltage Quiescent Drain Current Output Offset Voltage Input Bias Current Output Power d = 10 % f = 1 kHz Vs = 9 V RL = 8 Vs = 6 V R L = 8 Vs = 4.5 V RL = 4 RL = 8 f = 1 kHz f = 1 kHz Rs = 10 k B = 22 Hz to 22 kHz Curve A f = 100 Hz 100 3 2.5 40 Po = 0.5 W 2.7 0.9 RL = RL = 8 3 6 10 100 3.2 1.35 1 0.2 39 15 12 60 V mA mV nA W W W % dB k V V dB d Gv Ri e Distortion (f = 1 kHz) Closed Loop Voltage Gain Input Resistance Total Input Noise N SVR Supply Voltage Rejection 3/11 TDA2822 Figure 1 : Test Circuit (stereo). Figure 2 : P.C. Board and Components Layout of the Circuit of Figure 1 (1:1 scale). 4/11 TDA2822 Figure 3 : Test Circuit (bridge). Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale). 5/11 TDA2822 Figure 5 : Output Power vs. Supply Voltage (Stereo). Figure 6 : Output Power vs. Supply Voltage (Bridge). Figure 7 : Distorsion vs. Output Power (Bridge). Figure 8 : Distorsion vs. Output Power (Bridge). Figure 9 : Supply Voltage Rejection vs. Frequency. Figure 10 : Quiescent Current vs. Supply Voltage. 6/11 TDA2822 Figure 11 : Total Power Dissipation vs. Output Power (Stereo). Figure 12 : Total Power Dissipation vs. Output Power (Bridge). Figure 13 : Total Power Dissipation vs. Output Power (Bridge). 7/11 TDA2822 Figure 14 : Application Circuit for Portable Radios. MOUNTING INSTRUCTION The Rth j-amb of the TDA2822 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Figure 15) or to an external heatsink (Figure 16). The diagram of Figure 17 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side "" oftwo equalsquare copperareas having a thickness of 35 (1.4 mils). Figure 15 : Example of P.C. Board Copper Area which is used as Heatsink. During soldering the pins temperature must not exceed 260 C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 16 : External Heatsink Mounting Example. 8/11 TDA2822 Figure 6 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance vs. Side "". Figure 7 : Maximum Allowable Power Dissipation vs. Ambient Temperature. 9/11 TDA2822 POWERDIP 16 PACKAGE MECHANICAL DATA DIM. MIN. a1 B b b1 D E e e3 F I L Z 3.30 1.27 8.80 2.54 17.78 7.10 5.10 0.130 0.050 0.38 0.51 0.85 0.50 0.50 20.0 0.346 0.100 0.700 0.280 0.201 0.015 1.40 mm TYP. MAX. MIN. 0.020 0.033 0.020 0.020 0.787 0.055 inch TYP. MAX. 10/11 TDA2822 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1995 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A. 11/11 |
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